| 微异型接点带制备方法的研究现状 |
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| 引用本文： | 余前春,王欣平,范金铎.微异型接点带制备方法的研究现状[J].贵金属,2005,26(2):72-74. |
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| 作者姓名： | 余前春 王欣平 范金铎 |
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| 作者单位： | 有研亿金新材料股份有限公司,北京,102200 |
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| 摘 要： | 回顾了微异型接点带制备方法的研究现状，介绍了目前常用的制备方法：电镀 轧制、爆)咋复合 拉拔成型、滚焊复合 拉拔成型等及它们的优缺点。分析了目前存在的问题。
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| 关 键 词： | 金属材料 微异型接点带 电镀 爆炸复合 滚焊复合 PVD和CVD |
| 文章编号： | 1004-0676(2005)02-0072-03 |
| 修稿时间： | 2004年8月4日 |
Current Status of Manufacturing Methods of the Micro-profiled Contact Tapes |
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| YU Qianchun,WANG Xinping,FAN Jinduo.Current Status of Manufacturing Methods of the Micro-profiled Contact Tapes[J].Precious Metals,2005,26(2):72-74. |
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| Authors: | YU Qianchun WANG Xinping FAN Jinduo |
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| Abstract: | Manufacturing methods, including plating + rolling, explosion composite-forming + drawing, rolling welding + drawing and so on, for micro-profiled contact tape were reviewed in this paper. The advantages and disadvantages of these methods were summarized. |
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| Keywords: | Metal materials Micro-profiled contact tape Plating Explosion composite Rolling welding PVD and CVD |
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