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导电填料对电子浆料性能影响的研究进展
引用本文:冯清福,孟宪伟,李世鸿,梁云,李俊鹏.导电填料对电子浆料性能影响的研究进展[J].贵金属,2017,38(2):79-84.
作者姓名:冯清福  孟宪伟  李世鸿  梁云  李俊鹏
作者单位:昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,昆明,650106
基金项目:国家自然科学基金项目,云南省科技计划项目
摘    要:导电填料是导电浆料的重要组成部分,其决定了浆料的导电性能,同时影响烧结固化膜的焊接强度、机械强度等物理性能。根据导电填料的分类,从含量、粒径、形貌和表面性能等方面综述其对导电浆料性能影响的相关研究进展。介绍了新型石墨纳米填料,并提出进行纳米填料、低成本环保浆料的开发,丰富产品品种、提高产品质量的发展方向。

关 键 词:金属材料  电子浆料  填料  发展方向
收稿时间:2016/8/1 0:00:00

Research Progress in the Influence of Conductive Fillers on the Properties of Electronic Pastes
FENG Qingfu,MENG Xianwei,LI Shihong,LIANG Yun and LI Junpeng.Research Progress in the Influence of Conductive Fillers on the Properties of Electronic Pastes[J].Precious Metals,2017,38(2):79-84.
Authors:FENG Qingfu  MENG Xianwei  LI Shihong  LIANG Yun and LI Junpeng
Affiliation:State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China and State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals, Kunming 650106, China
Abstract:As an ingredient of conductive pastes, the conductive filler plays a crucial role in determining the conductivity of the slurry, and it also affects the welding strength, mechanical strength and other physical properties of the sintered film. The effect of conductive fillers on the slurry performance is reviewed from every aspect of the content, particle size, morphology and surface properties of the fillers. The new graphite nano-packing is also introduced. The future trends for conductive pastes, the authors suggested, should be using nano-packing materials, developing low-cost and environmentally friendly process and expanding the product variety as well as to improving product quality.
Keywords:metal materials  electronic paste  packing  development direction
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