| 金合金电镀的发展 |
| |
| 引用本文： | 郭珊云,周光月,陈志全,郑恩华,胡劲.金合金电镀的发展[J].贵金属,1999,20(1):53-57. |
| |
| 作者姓名： | 郭珊云 周光月 陈志全 郑恩华 胡劲 |
| |
| 作者单位： | 昆明贵金属研究所,中国,昆明,650221 |
| |
| 摘 要： | 介绍几种金基合金电镀的发展历程，比较几种镀液的性能特点并讨论几种金合金电镀的现况及未来的发展趋势。
|
| 关 键 词： | 金 合金 电镀 |
Development of Gold-Alloy Plating |
| |
| Guo Shanyun,Zhou Guangyue,Chen Zhiquan,Zheng Enhua,Hu Jin.Development of Gold-Alloy Plating[J].Precious Metals,1999,20(1):53-57. |
| |
| Authors: | Guo Shanyun Zhou Guangyue Chen Zhiquan Zheng Enhua Hu Jin |
| |
| Abstract: | The paper introduced the development of several gold-alloy plating,compared the character of several plating baths,and discussed present situation and development tendency for several gold-alloy plating. |
| |
| Keywords: | Gold Alloy Plating |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
