| 低温固化银浆导电性能的研究 |
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| 引用本文： | 黄富春,李晓龙,李文琳,熊庆丰,赵玲,晏廷懂,余伟,刘继松.低温固化银浆导电性能的研究[J].贵金属,2011,32(2). |
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| 作者姓名： | 黄富春 李晓龙 李文琳 熊庆丰 赵玲 晏廷懂 余伟 刘继松 |
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| 作者单位： | 贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明,650106 |
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| 摘 要： | 对不同条件下制备的片状银粉与不同种类树脂体制备的银浆导电性能进行比较,讨论了表面分散剂、表面处理、球磨时间、树脂种类、固化温度等对低温固化银浆电性能的影响,对影响导电性能的因素与导电机理进行了探讨。
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| 关 键 词： | 金属材料 片状银粉 银浆 低温固化 |
The Conductivity of Silver Paste Cured at Low Temperature |
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| HUANG Fuchun,LI Xiaolong,LI Wenlin,XIONG Qingfeng,ZHAO Ling,YAN Tingdong,YU Wei,LIU Jisong.The Conductivity of Silver Paste Cured at Low Temperature[J].Precious Metals,2011,32(2). |
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| Authors: | HUANG Fuchun LI Xiaolong LI Wenlin XIONG Qingfeng ZHAO Ling YAN Tingdong YU Wei LIU Jisong |
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| Affiliation: | HUANG Fuchun,LI Xiaolong,LI Wenlin,XIONG Qingfeng,ZHAO Ling,YAN Tingdong,YU Wei,LIU Jisong (State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China) |
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| Abstract: | The conductivity of flake silver powder prepared under different conditions and in different resin systems was compared.The effects of surface dispersant,surface treatment,milling time,resins and curing temperature on the conductive performance were discussed.The conductive mechanism was further explored. |
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| Keywords: | metal materials flake silver silver paste low temperature curing |
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