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引线框架材料C194x的组织性能分析
引用本文:曹兴民,郭富安,向朝建,慕思国,杨春秀,朱雯.引线框架材料C194x的组织性能分析[J].热加工工艺,2006,35(14):22-24.
作者姓名:曹兴民  郭富安  向朝建  慕思国  杨春秀  朱雯
作者单位:苏州有色金属加工研究院,江苏,苏州,215021
摘    要:利用光镜、SEM和TEM等手段研究了热处理对合金微观组织的影响,通过测定应力-应变曲线、维氏硬度和电导率来研究合金的性能变化规律,并分析了材料组织性能变化的机理。

关 键 词:引线框架材料  铜合金  变形量
文章编号:1001-3814(2006)14-0022-03
收稿时间:2006-01-22
修稿时间:2006年1月22日

Analyze on Microstructure and Properties of Integrated Circuit Frame Materials C194x
CAO Xing-min,GUO Fu-an,XIANG Chao-jian,MU Si-guo,YANG Chun-xiu,ZHU Wen.Analyze on Microstructure and Properties of Integrated Circuit Frame Materials C194x[J].Hot Working Technology,2006,35(14):22-24.
Authors:CAO Xing-min  GUO Fu-an  XIANG Chao-jian  MU Si-guo  YANG Chun-xiu  ZHU Wen
Affiliation:Suzhou Institute for Non-ferrous Metal Processing Research, Suzhou 215021,China
Abstract:The effect of heat treatment on mechanical properties and electrical conductivity of the ahoy were investigated by OM,SEM and TEM.The rule of microstruction transformation and property changes were analysed by measuring stress-strain curves,hardness and electrical conductivity.The mechanism of the change of microstruction and properties were discussed.
Keywords:integrated circuit frame  copper alloy  deformation
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