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液固相复合-轧制铜包钢线的组织性能及界面冶金行为
引用本文:方晓英.液固相复合-轧制铜包钢线的组织性能及界面冶金行为[J].热加工工艺,2006,35(9):9-11,16.
作者姓名:方晓英
作者单位:山东理工大学,机械工程学院,山东,淄博,255049
摘    要:以液固相复合-轧制工艺生产的铜包钢线为研究对象,研究了在特定工艺条件下铜/钢界面的组织组成及其界面区的冶金行为.经金相组织观察,铜、钢晶粒在界面处直接接触,界面呈极细微的凹凸不平的状态,经冷轧后,铜、钢晶粒在界面处互相咬合,且铜与钢的变形随着变形量的增大而趋于均匀.通过对界面区的成分进行能谱分析表明,Cu,Fe原子间发生了互扩散,形成了Fe/Cu的固溶体,其中Fe向Cu扩散量明显高于Cu向Fe的扩散量,测试界面结合强度表明,铜包钢线的初结合界面剪切强度可达80~95 MPa,轧制变形后该强度可提高3%~5%.

关 键 词:液固相复合  铜包钢线  扩散  复合机理
文章编号:1001-3814(2006)09-0009-03
收稿时间:2006-01-04
修稿时间:2006-01-04

Microstructrue and Bonding Metallurgical Behavior of Copper Cladding Steel Wire by Iiquid and Solid Bonding and Rolling Process
FANG Xiao-ying.Microstructrue and Bonding Metallurgical Behavior of Copper Cladding Steel Wire by Iiquid and Solid Bonding and Rolling Process[J].Hot Working Technology,2006,35(9):9-11,16.
Authors:FANG Xiao-ying
Affiliation:School of Mech.Eng.,Shandong University of Technology, Zibo 255049, China
Abstract:The paper presents an investigation on microstructur~ and metallurgical behavior of copper cladding steel wire produced by liquid and solid bonding and rolling process at certain process condition. Microstructure observation shows that crystals of copper and steel are in contact directly and the interface is rugged in micro-area at the interface as well, which contributes to good bonding between copper layer and steel core wire. After cold rolling, the copper crystals are observed to have been inserted into the inner of steel crystals, which further enhances the bonding strength. In addition, the deformation of copper and steel becomes uniform gradually with the increasing forming. The element analysis indicates that the solid solution occurs on the interface with the mutual diffusion of Fe and Cu atoms through energy spectrum method. The diffusion amount of Fe is more than that of Cu obviously. The bonding strength tests show that the bonding strength reaches 80-95 MPa after casting and the strength value will rise about 3%-5% after cold rolling.
Keywords:liquid and solid bonding  copper cladding steel wire  diffusion  bonding mechanism
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