Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn?Ag?Cu alloys with Bi additions |
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| Authors: | I Ohnuma K Ishida Z Moser S G?sior K Bukat J Pstru? R Kisiel J Sitek |
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| Affiliation: | (1) Department of Materials Science, Graduate School of Engineering, Tohoku University, Aoba-yama 02, 980-8579 Sendai, Japan;(2) Institute of Metallurgy and Materials Science, Polish Academy of Sciences, 25 Reymonta Street, 30059 Kraków, Poland;(3) Tele and Radio Research Institute, Ratuszowa Str. 11, 03-450 Warszawa, Poland;(4) Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Koszykowa Str. 75, 00-662 Warszawa, Poland |
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| Abstract: | The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butler's
model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic
database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the
ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes
lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders.
The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized
by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free
solders, a compromise among various properties should be taken into consideration. |
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| Keywords: | phase equilibria simulation of solidification surface tensions Sn− Ag− Cu− Bi |
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