首页 | 本学科首页   官方微博 | 高级检索  
     

高强高导铜合金的若干进展
引用本文:钟仁显,卢百平.高强高导铜合金的若干进展[J].铸造技术,2007,28(3):384-388.
作者姓名:钟仁显  卢百平
作者单位:南昌航空工业学院材料科学与工程学院,江西,南昌,330063
摘    要:概述了高强高导铜合金的制备方法及其特点。指出合金化法通过固溶强化和析出强化等手段来强化铜基体,工艺简单,成本较低,但在保持铜合金高导电的同时,对强度的提高有一定限度;复合材料法通过向铜基体中引入第二强化相形成复合材料,铜合金的电导性不会明显下降,而其强度可显著提高,但工艺较复杂。同时,评述了高强高导铜合金的研究热点,认为多元微合金化、快速凝固、机械合金化和定向凝固等方法代表着今后高强高导铜合金的研究方向。

关 键 词:高强高导铜合金  合金化  复合强化  快速凝固  机械合金化  定向凝固
文章编号:1000-8365(2007)03-0384-05
修稿时间:01 30 2007 12:00AM

Some Development of High-strength and High-conductivity Copper Alloys
ZHONG Ren-xian,LU Bai-ping.Some Development of High-strength and High-conductivity Copper Alloys[J].Foundry Technology,2007,28(3):384-388.
Authors:ZHONG Ren-xian  LU Bai-ping
Affiliation:School of Material Science and Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330063 ,China
Abstract:The fabrication principles and characteristics of high-strength and high-conductivity copper alloy are summarized. The technology, which uses alloying method to strengthen copper matrix by solution strengthening and precipitation strengthening, is simple and has an inexpensive cost as well. However, the method has a limitation to the increase of the strength while its conductivity retains a higher value. The conductivity of the copper base composite, which is fabricated by introducing the secondary strengthening phase in to the copper matrix, does not decrease obviously, but the strength increases significantly. Meanwhile, the hot research fileds of high-strength and high- conductivity copper alloys are discussed. It is pointed out that multi-element alloying, rapid solidification, mechanical alloying, and directional solidification in the fabrication for high-strength and high-conductivity copper alloys should be paid more attention in the future.
Keywords:High-strength and high-conductivity copper alloy  Alloying  Strengthening based composite ~ Rapid solidification  Mechanical alloying  Directional solidification
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号