The Effect of Microstructure on the Electrical Properties of Gas-Atomized Copper–Iron Metastable Alloys

With the increase in global demand for highly functionalized materials, there is continued interest in exploiting the material properties of metals either individually or in the form of alloys. Copper–iron alloy is considered unique with its remarkable combination of strength and high electrical conductivity. Due to the low cost of iron, this alloy is expected to replace alloys like Cu–Ag and Cu–Nb. In order to explore the microstructural features, copper–iron alloy with three different compositions (10, 30, and 50 at.% Fe) were prepared by a gas atomization process. A detailed microstructural characterization was performed using scanning electron microscopy, X-ray diffraction, and electron backscattered diffraction. Spark plasma sintering was used to sinter the powders to evaluate their electrical conductivities. The mechanism of the microstructure formation is also discussed in detail. As the Fe content increases, the Fe-rich phase changes its shape from spherical to irregular with a concomitant sharp decrease in the electrical conductivity of the alloy.