W/Cu功能梯度材料的制备及应用

W/Cu功能梯度材料性能优异应用广泛,以W/Cu功能梯度材料的制备方法为研究对象,探讨不同制备方法存在的优缺点,包括熔渗法、粉末冶金法及等离子喷涂法。作为等离子体材料应与等离子体相适应,耐热冲蚀。在电子领域中,其一侧应满足与基板的封接问题,另一侧满足高导热、低热膨胀系数的要求。目前虽然研发出多种新工艺、新技术,但需进一步了解其控制因素及影响机理,另外每种工艺适用范围比较小,需开发高效、低成本、适用广、易控制的制造工艺。

Fabrication and Application of W/Cu Functionally Graded Material

W/Cu functionally graded materials(FGM) are widely applied because of their excellent performance.The preparation methods of W/Cu FGM,including the plasma spray coating technology,the powder metallurgical method and plasma sprayed coating method,are introduced in this paper,and the advantages and disadvantages of each method are analysed.As PFC it should adapt to plasma and resist heat flow erosion.In electronic,one side of the FGM should meet the requirement of sealing with the substrate,and the other side of it should have high thermal conductivity and low thermal expansion coefficient.Many new techniques and technologies are developed,but the control factors and influence mechanism need further study.And the application scope of each process is relatively small.Therefore,manufacturing processes with the advantages of high efficiency,low cost,wide application and easy control are urgently needed to develop.