| 金刚石/铜电子封装复合材料的研究状况及展望 |
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| 引用本文： | 赵妍冰,刘克明,陆德平,杨滨.金刚石/铜电子封装复合材料的研究状况及展望[J].热处理技术与装备,2013(6):31-36. |
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| 作者姓名： | 赵妍冰 刘克明 陆德平 杨滨 |
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| 作者单位： | [1]北京科技大学新金属材料国家重点实验室,北京100083 [2]江西省科学院应用物理研究所,江西南昌330029 |
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| 基金项目： | 江西省铜钨新材料重点实验室开放基金项目（2012-KLP-1） |
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| 摘 要： | 随着电子信息技术的迅速发展,电子仪器向小型化、便携化、多功能化方向发展,传统的电子封装材料已经不能满足现代集成电路电子封装的要求。金刚石/铜复合材料作为新型电子封装材料,具有高的热导率、可控的热膨胀系数、较低的密度等特点,近年来成为研究的热点。本文概述了金刚石/铜复合材料的制备工艺及优良性能,并对其未来应用进行了展望。
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| 关 键 词： | 电子封装材料 金刚石 铜复合材料 热导率 |
Research Status and Prospect of CD/Cu Composite for Electronic Packaging Material |
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| ZHAO Yan-bing,LIU Ke-ming,LU De-ping,YANG Bin.Research Status and Prospect of CD/Cu Composite for Electronic Packaging Material[J].Heat Treatment Technology and Equipment,2013(6):31-36. |
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| Authors: | ZHAO Yan-bing LIU Ke-ming LU De-ping YANG Bin |
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| Affiliation: | 1. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China; 2. Institute of Applied Physics, Jiangxi Academy. of Sciences, Nanchang Jiangxi 330029, China) |
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| Abstract: | With the rapid development of electronic information technology, electronic oped miniaturization, portable, multi-functionalization, and traditional electronic pac instrument is devel- kaging material can not meet the need of modern integrated circuit package. Diamond/Cu （CD/Cu） composite as new elec- tronic packaging material has the characteristics of high thermal conductivity, controllable thermal expan- sion coefficient, lower density, etc. In recent years, it becomes hotspot of research. This article outlines the preparation technology and excellent performance of the CD/Cu composite for electronic packaging And the development of CD/Cu composite for electronic packaging is also reviewed. |
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| Keywords: | electronic packaging material CD/Cu composite thermal conductivity |
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