| 甘油铜络合物溶液化学镀铜的研究 |
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| 引用本文： | 王鸿显,赵红坤.甘油铜络合物溶液化学镀铜的研究[J].腐蚀科学与防护技术,2007,19(3):178-180. |
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| 作者姓名： | 王鸿显 赵红坤 |
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| 作者单位： | 1. 南通大学,化学化工学院,南通,226007
2. 扬州大学,化学化工学院,扬州,225002 |
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| 摘 要： | 采用单因素优选实验法研究了影响化学镀铜速率和甘油铜镀液稳定性的各因素，确定了适宜的甘油铜化学镀液配方和工艺条件.结果表明，优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好.
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| 关 键 词： | 甘油铜络合物 化学镀铜 沉铜速度 |
| 文章编号： | 1002-6495（2007）03-0178-03 |
| 收稿时间： | 2006-07-01 |
| 修稿时间： | 2006-07-012006-08-20 |
STUDY OF ELECTROLESS COPPER PLATING FROM COPPER-GLYCERIN COMPLEX SOULTION |
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| WANG Hong-xian,ZHAO Hong-kun.STUDY OF ELECTROLESS COPPER PLATING FROM COPPER-GLYCERIN COMPLEX SOULTION[J].Corrosion Science and Protection Technology,2007,19(3):178-180. |
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| Authors: | WANG Hong-xian ZHAO Hong-kun |
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| Affiliation: | 1. College of Chemistry and Chemical Engineering, Nantong University,Nantong 226007; 2. College of Chemistry and Chemical Engineering, Yangzhou University, Yangzhou 225002 |
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| Abstract: | The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. The formulation of bath solution and processing parameters were established by the research. The results show that the proposed bath solution was highly stabile, by which cupper plating had high deposition rate with good appearence. Therefore, the copper-glycerin camplex solution shows a good prospect for copper plating. |
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| Keywords: | copper - glycerin complex electroless copper plating deposition rate bath stability |
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