金刚石化学镀镍的研究

目的增强金刚石与基体的结合强度。方法采用"除油—粗化—敏化活化—解胶"的方法对金刚石进行预处理,通过化学镀镍方法对金刚石进行表面改性,结合扫描电子显微镜及X射线能谱仪研究不同参数对化学镀镍层的影响。结果在粒度为10μm左右的金刚石表面镀覆致密镍层的最佳工艺参数为:Ni SO4·6H2O(主盐)25 g/L,次亚磷酸钠30 g/L,乳酸15 g/L,乙酸钠15 g/L,稳定剂20 mg/L,光亮剂1 g/L,p H=5.5,温度85℃。结论次亚磷酸钠含量、硫脲含量、p H值、温度对镀覆时间、金刚石增重比及镀层形貌有影响,以最佳工艺参数获得的金刚石镍镀层包覆完整均匀,质量较好。

Study of Electroless Plating Nickel on the Diamond

Objective To enhance the bonding strength between the diamond and the substrate. Methods The diamond was pre-treated with a method of "degreasing—roughening—sensitizing activation—glue", and then surface was modified by electroless nickel plating on the diamond. The influence of different parameters on chemical plated nickel layer was studied by scanning elec-tron microscopy and energy dispersive X-ray. Results The optimum technical parameters of nickel layer on the diamond about 10 microns:NiSO4·6H2O (main salt) 25 g/L, hypophosphite 30 g/L, lactic acid 15 g/L, sodium acetate 15 g/L, the stabilizer 20 mg/L, brightener 1 g/L, pH=5. 5, temperature 85 ℃. Conclusion Hypophosphite content, thiourea content, pH, and tempera-ture may affects the plating time, the diamond coating weight gain ratio and morphology of chemical nickel. The diamond was coa-ted complete uniform with the optimal parameters.