电子工业中电沉积金镀层的应用与发展

金镀层具有良好的导电性、耐腐蚀性、稳定性等特点,在半导体、集成电路、电子元器件产品等方面具有重要的应用价值。随着电子产品零件表面镀金的重要性日益提升,国内外一直在提高镀金工艺技术的稳定性、镀层功能性方面进行了大量研究,而且在多种电子工业产品中的关键镀金技术研究方面开展的工作也越来越深入。从不同的角度综述了目前电子及相关行业中应用电镀金层及电镀金技术的情况,探讨了电镀金层及电镀金技术在电子工业领域的应用进展,分析了在不同基体材料表面沉积金层的技术(如制作薄膜基板的导带、线路板的接地通孔及上下层互连通孔、键合点、焊盘及空气桥等),介绍了镀金层的主要功能(如抗变色和抗化学腐蚀性能,低的接触电阻和导电性,高温下的抗氧化性能,贮存过程中的焊接性能,物理、机械性能等)。对电子行业现代化带动镀金技术的发展与需求,提出了开发和应用无氰镀金技术以及学科交叉对促进镀金技术发展的趋势,肯定了镀金技术对电子领域科技进步的贡献。

Application and Development of Gold Plating in Electronic Industry

Due to good conductivity, corrosion resistance and good stability, gold plating is of important application value in semiconductors, integrated circuits, electronic component products, etc. As the importance of gold plating technology on electronic products increases, a lot of studies has been done both at home and abroad to improve stability of gold plating process and plating functionality. Moreover, more thorough work has been done to study gold plating technology in various electronic industry products. Application progress of gold plating and gold plating technology in the electronic and related industries was reviewed from different perspectives. The application of gold plating and plating technology in the field of electronic industry was discussed as well. Technologies of depositing gold plating on different substrates were analyzed (such as fabricating conduction band for thin film substrate, grounding through hole as well as upper and lower interconnected hole for circuit board, bonding points, bonding pads, air bridge, etc.). Main functions of the gold plating (resistance to discoloration and chemical corrosion, low electrical conductivity and contact resistance, high temperature oxidation resistance, welding properties after long-term storage, physical and mechanical properties, etc) were introduced. For the development and demand of promoting gold plating technologies being driven by electron industry modernization, it is proposed that development and application of cyanide-free gold plating technologies as well as subject crossing tend to promote development of gold plating technologies. In addition, contribution of gold plating technologies to technological progress in the field of electronics is affirmed.