TC4钛合金化学铣切槽液调整与再生

目的研究钛合金腐蚀加工液中钛离子的去除方式,为化学铣切溶液的循环再生提供理论依据。方法向钛合金化学铣切溶液中加入沉淀剂去除过量钛离子,借助紫外分光光度计表征溶液中钛离子的去除效果,通过扫描电镜、能谱仪、X射线衍射仪研究沉淀物的成分及其组织结构,通过调整滤液成分检测循环溶液的化学铣切能力。结果当钛合金化学铣切溶液中钛离子质量浓度达70~90 g/L时,金属离子导致溶液黏稠,溶液腐蚀加工性能变差,化学铣切溶液很难继续溶解钛合金。通过向该溶液中加入盐类物质,发现当加入氟化钾时,溶液中的钛离子去除率最高,可达90%以上。检测发现,经水洗干燥后的钛离子沉淀物为纯净的氟钛酸钾晶体。通过补加酸液和添加剂,溶液可重新恢复化铣性能,化学铣切速度和试样表面粗糙度均满足工业要求。结论钛合金化学铣切溶液通过沉淀钛离子再调整可循环使用,提高了化学铣切溶液的使用寿命,减少了污染物排放。

Adjustment and Regeneration of Chemical Milling Solution for TC4 Titanium Alloy

The work aims to study removal method of titanium ion in the titanium alloy corrosion solution, and to provide theoretical approaches for the chemical milling solution circulation and regeneration. The excess titanium ion was removed by adding precipitant to the chemical milling solution of titanium alloy. The removal effect of titanium ion was characterized by ultraviolet spectrophotometer. The composition and microstructure of the precipitate were studied by scanning electron microscopy, electronic differential system and X-ray diffraction analysis. The chemical milling ability of the circulating solution was detected by adjusting the filtrate components. When the titanium ion reached 70~90 g/L in the chemical milling solution, metal ions led to solution viscosity and deterioration of solution corrosion processing performance. The chemical milling solution was difficult to continue to dissolve titanium alloy. When salt was added to the solution, the removal rate of titanium ions in the solution was the highest and up to 90% when potassium fluoride was added. The washed and dried titanium ion precipitate was detected to be pure potassium fluorine crystal. The chemical milling performance could be restored by adding acid and additives and the chemical milling speed and the surface roughness of the sample met the industrial requirements. The titanium alloy chemical milling solution can be recycled by readjusting the precipitant titanium ion, thereby improving the service life of the chemical milling solution and reducing the pollutant emission.