| 世界表面精饰技术进展 |
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| 引用本文： | 方景礼.世界表面精饰技术进展[J].表面技术,1989,18(6):40-46. |
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| 作者姓名： | 方景礼 |
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| 作者单位： | 南京大学应用学化研究所 |
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| 摘 要： | 论述了合金电镀的新成果;复合镀、高速电镀,脉冲及其它波形电镀的进展,并且介绍了各种新型电镀光亮剂.
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| 关 键 词： | 电镀 表面精饰技术 |
Development of the World Surface Technology |
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| Fang Jingli.Development of the World Surface Technology[J].Surface Technology,1989,18(6):40-46. |
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| Authors: | Fang Jingli |
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| Abstract: | This paper relates the new achievments in alloy plating field and the development of composite plating, high speed electroplating, pulse plating and some other waveform platings, finally introduces new brighteners of various types for plating. |
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| Keywords: | surface technology alloy plating dispersion plating high-speed plating pulse plating additive |
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