| 镍铁钨合金的电沉积行为研究 |
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| 引用本文： | 徐超,陈范才,吴道明,王子天,李文珍,李林. 镍铁钨合金的电沉积行为研究[J]. 表面技术, 2010, 39(5): 26-29,71. DOI: 10.3969/j.issn.1001-3660.2010.05.008 |
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| 作者姓名： | 徐超 陈范才 吴道明 王子天 李文珍 李林 |
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| 作者单位： | 湖南大学,化学化工学院,长沙,410082;湖南大学,化学化工学院,长沙,410082;湖南大学,化学化工学院,长沙,410082;湖南大学,化学化工学院,长沙,410082;湖南大学,化学化工学院,长沙,410082;湖南大学,化学化工学院,长沙,410082 |
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| 摘 要： | 应用电化学方法研究了Ni-Fe-W合金的电沉积机理,并对Ni-Fe-W合金镀层的微观形貌和组成成分进行了表征.循环伏安测试表明,Ni-Fe-W合金电沉积是不可逆电极过程,且WO42-浓度的变化不改变电沉积机理;计时电流法研究表明,Ni-Fe-W合金在铜电极上的电结晶过程符合三维瞬时成核的生长机理;SEM和EDS结果表明,Ni-Fe-W合金镀层由纳米级的小颗粒组成,合金的组成为Ni 58.76%,Fe 32.72%,W 8.52%(原子数分数,后同).
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| 关 键 词： | 镍铁钨合金 电沉积 成核机理 |
| 收稿时间： | 2010-07-19 |
| 修稿时间： | 2010-10-10 |
A Study on the Electrodeposition Behaviors of Nickel-iron-tungsten Alloy |
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| XU Chao,CHEN Fan-cai,WU Dao-ming,WANG Zi-tian,LI Wen-zhen and LI Lin. A Study on the Electrodeposition Behaviors of Nickel-iron-tungsten Alloy[J]. Surface Technology, 2010, 39(5): 26-29,71. DOI: 10.3969/j.issn.1001-3660.2010.05.008 |
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| Authors: | XU Chao CHEN Fan-cai WU Dao-ming WANG Zi-tian LI Wen-zhen LI Lin |
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| Affiliation: | School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China,School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China,School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China,School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China,School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China and School of Chemistry and Chemical Engineering of Hunan University,Changsha 410082,China |
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| Abstract: | The electrodeposition mechanism of nickel-iron-tungsten alloy were studied by the methods of electrochemistry, and the micromorphology and composition of nickel-iron-tungsten alloy were characterized.Cyclic voltammogram indicated that the electrodeposition of nickel-iron-tungsten alloy wasirreversible growth process,and the electrocrystal-lization mechanism didn''t change with the variety of the concentration of WO42-.Chronoamperometric results indicated that the electrodeposition of nickel-iron-tungsten alloy at copperelectrode belonged to a three-dimensionalinstantaneous nucleationmech-anism. SEM images of electrodeposit showed that the nickel-iron-tungsten alloy was made of lots of crystalline grain which was several tens nanometers, and the atom composition was 58.76%Ni,32.72%Fe,8.52%W. |
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| Keywords: | nickel-iron-tungsten electrodeposition electrocrystallization mechanism |
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