化学镀的研究进展及发展趋势

化学镀能够有效增强基体材料的表面性能,拓展其应用范围,在许多领域具有广泛的应用前景。综述了化学镀的基本原理、处理方法及施镀工艺,详细讨论了化学镀的研究进展。归纳了化学镀层的种类及应用技术,主要包括化学镀镍、化学镀铜、化学镀钴、化学镀银、化学镀锡、化学镀金等。分别讨论了各类化学镀的研究进展、优势、劣势及应用范围。在此基础上归纳了化学镀存在的问题,主要为对能源的消耗和对环境的污染,引起了人们的广泛关注。化学镀技术发展呈现多元化的趋势,主要集中在激光增强化学镀、超声波化学镀、粉体化学镀、多层化学镀、稀土化学镀、复合化学镀。化学镀未来的发展方向一是原有化学镀工艺的进一步完善和提高,二是具有商业价值的新领域以及超功能性新材料所带来的化学镀技术新应用。

Research Progress and Development Trend of Chemical Plating

Chemical plating can enhance surface properties of substrate materials effectively and expand its application range of substrate materials, hence it has extensive application prospect in many fields. Basic principle, handling method and application technology of chemical plating were reviewed. Research progress of electroless plating were discussed in detail, and types and application technologies of chemical plating were summarized, mainly including chemical nickel plating, chemical copper plating, chemical cobalt plating, chemical silver plating, chemical tin plating and chemical gold plating. Moreover, re-search progress, advantages, disadvantages and application scope of various chemical plating were discussed. Problems of chemical plating were concluded. The main concerns—energy consumption and environmental pollution have attracted much public concern. Chemical plating technology showed diversification trend of development, mainly in laser-enhanced chemical plating, ultrasonic chemical plating, powder chemical plating, multi-layer chemical plating, rare earth chemical plating and composite electroless plating. One development direction of chemical plating in the future is to further improve original chemi-cal plating process, the other is new application of chemical plating technology brought by new field of commercial value and super functional new materials.