| 镀液组成和工艺条件对电沉积钴钨合金成分的影响 |
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| 引用本文： | 黄丽红,葛洪良,崔玉建.镀液组成和工艺条件对电沉积钴钨合金成分的影响[J].表面技术,2003,32(2):41-43. |
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| 作者姓名： | 黄丽红 葛洪良 崔玉建 |
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| 作者单位： | 中国计量学院,浙江,杭州,310014 |
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| 基金项目： | 浙江省自然科学基金 ;RC01056; |
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| 摘 要： | 研究了镀液中钨盐浓度，络合剂浓度，钠离子，电流密度，镀液温度等对电沉积钴钨合金成份的影响，结果表明：合金中的钨含量随钨盐浓度，电流密度和温度的升高而增大，随络合剂，钠离子浓度的升高而降低。
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| 关 键 词： | 电沉积 钴钨 合金成份 |
| 文章编号： | 1001-3660(2003)02-0041-03 |
Effects of Plating Baths and Process Conditions on Alloy Composition of Cobalt-tungsten Deposits |
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| HUANG Li hong,GE Hong liang,CUI Yu jian.Effects of Plating Baths and Process Conditions on Alloy Composition of Cobalt-tungsten Deposits[J].Surface Technology,2003,32(2):41-43. |
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| Authors: | HUANG Li hong GE Hong liang CUI Yu jian |
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| Abstract: | The effects of tungsten salt, complex agent, sodium ion, current density and temperature on alloy composition of cobalt-tungsten deposits are studied in this paper. The results show that the tungsten content in cobalt-tungsten alloy increases with the increasing of tungsten salt concentration, current density and temperature, decreases with the increasing of complex agent and sodium ion concentration. |
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| Keywords: | Electrodeposition Cobalt-tungsten Alloy composition |
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