压力与温度敏感涂料用高分子粘结剂的研究进展

压力敏感涂料(PSP)以及温度敏感涂料(TSP)是通过光学手段研究物体表面压力和温度的功能涂层。简述了气体在聚合物中的渗透机理,发光分子氧猝灭以及热猝灭机理,综述了国内外PSP、TSP中常用的高分子粘结剂,并对PSP、TSP所用高分子粘结剂的未来发展方向进行了展望。这两种涂层均由高分子粘结剂和发光分子探针组成,PSP通过发光探针与氧分子作用产生的光物理行为变化来反映压力大小,TSP是通过发光探针随模型表面温度变化导致光物理行为变化来反映温度高低。目前,已发展的PSP用高分子粘结剂主要为氧透过率较高的含硅聚合物及丙烯酸酯类聚合物;已发展的TSP用高分子粘结剂主要为氧透过率较低的聚苯乙烯、聚丙烯腈、聚氨酯等。高分子粘结剂的主链结构、侧基种类与极性、分子间堆砌密度以及与发光分子相互作用,对涂层光物理性能、力学性能以及与基材结合力产生影响。因此,研究PSP与TSP中的高分子粘结剂对于未来两种技术的优化以及一定特殊要求下的应用有较为重要的意义。

Research Progress of Polymer Binders for Pressure and Temperature Sensitive Paints

Pressure-sensitive paints (PSP) and thermal-sensitive paints (TSP) are functional coatings that study the surface pressure and temperature of objects by optical means. The gas permeation mechanism in polymers and the oxygen quenching and thermal quenching mechanisms of luminescent molecules were briefly introduced. The polymer binders commonly used in PSP and TSP at home and abroad were reviewed, and the future development direction of polymer binders for PSP and TSP was also prospected. Both coatings consisted of a polymer binder and a luminescent molecular probe. PSP produced changes in photophysical behavior to reflect the pressure through the interaction of luminescent probes and oxygen molecules, while TSP reflected the temperature through changes in photophysical behavior caused by the changing luminescent probes with the surface temperature of the model. Currently, polymer binders used in PSP are mainly silicon-containing polymers and acrylate polymers with high oxygen permeability. Polymer binders for TSP are mainly polystyrene, polyacrylonitrile, polyurethane, etc. with low oxygen permeability. The main chain structure of polymer binders, the type and polarity of side groups, the intermolecular packing density, and the interaction with light-emitting molecules will affect the photophysical properties and mechanical properties of the coating as well as the binding force with the substrate. Therefore, it is of great significance to study the polymer binders in PSP and TSP for the optimization of the two technologies in the future and the application under certain special requirements.