| 化学镀铜的进展 |
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| 引用本文： | 熊海平,萧以德,伍建华,付志勇.化学镀铜的进展[J].表面技术,2002,31(6):5-6,11. |
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| 作者姓名： | 熊海平 萧以德 伍建华 付志勇 |
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| 作者单位： | 武汉材料保护研究所,湖北,武汉,430030 |
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| 摘 要： | 综述了化学镀铜的应用领域,化学镀铜工艺的研究进展,简述了化学镀铜机理的研究现状,提出了有待进一步深入研究的问题.
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| 关 键 词： | 化学镀铜 工艺 机理 |
| 文章编号： | 1001-3660(2002)06-0005-02 |
Development of Electroless Copper Plating |
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| XIONG Hai ping,XIAO Yi de,WU Jian hua,FU Zhi yong.Development of Electroless Copper Plating[J].Surface Technology,2002,31(6):5-6,11. |
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| Authors: | XIONG Hai ping XIAO Yi de WU Jian hua FU Zhi yong |
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| Abstract: | A review is made on the application areas and the development of technics of electroless copper plating. The research works on the mechanism of electroless copper plating are also summarized. Some research problems needed to be settled in the future are indicated. |
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| Keywords: | Electroless copper plating Technics Mechanism |
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