金属Cu熔化及晶化行为的计算机模拟

采用分子动力学方法对500个金属Cu原子的模型体系在熔化及晶化过程中的结构组态、能量变化进行了计算机模拟研究．原子间作用势采用FS势．模拟结果表明：在连续升温过程中，金属Cu在1444K熔化；在较慢冷却条件下，液Cu在1014K结晶；在较快冷速条件下，液Cu形成非晶态．从能量的角度分析了模拟过程中温度变化速率对结果的影响，并给出了体系微观结构与能量变化关系的物理图像．

The Simulation of Metal Cu In The Melting and Solidification Process

The structure and energy of the system formed by 500 Cu-atoms controlled by the period boundary condition have been studied by the molecular dynamics simulation in the melting and solidification process, in which the FS potential was used. The conclusion obtained is that the melting point of Cu is 1444 K at continuous heating process, the crystallized point is 1014 K at slower cooling rate and the non-crystalline phase will be formed at faster cooling rate. In the end, the influence of the temperature changing rate has been analyzed from a view of the total energy changing, and the relationship between the microstructure and the system total energy has been pointed out.