| SiCp增强Al基复合材料的真空扩散焊接 |
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| 引用本文： | 张新平 魏巍. SiCp增强Al基复合材料的真空扩散焊接[J]. 金属学报, 1999, 35(2): 198-202 |
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| 作者姓名： | 张新平 魏巍 |
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| 作者单位： | 西安交通大学材料学院!西安７１００４９ |
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| 基金项目： | 西安交通大学金属材料力学行为国家实验室研究基金，西安交通大学科研基金，德国亚历山大-冯-洪堡基金 |
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| 摘 要： | 采用真空扩散焊接方法研究了同质及异质ＳｉＣｐ增强Ａｌ基复合材料的连接特性，考察了ＳｉＣｐ体积分数变化及插入中间合金层对同质及异质Ａｌ合金基复合材料真空扩散焊接质量及接头性能的影响。研究结果表明，无论同质还是异质Ａｌ合金基复合材料，真空扩散焊接头的强度均随ＳｉＣｐ体积分数的增加而降低；获得满意的异质ＳｉＣｐ增强Ａｌ合金基复合材料的真空扩散焊连接远比同质材料时困难。研究结果还表明，无论同质还是异质Ａｌ
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| 关 键 词： | 复合材料 真空扩散焊接 铝基 碳化硅 |
INVESTIGATION ON DIFFUSION BONDING CHARACTERISTICS OF SiCp REINFORCED ALUMINIUM MATRIX COMPOSITE |
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| ZHANG Xinping,WEI Wei,QUAN Gaofeng. INVESTIGATION ON DIFFUSION BONDING CHARACTERISTICS OF SiCp REINFORCED ALUMINIUM MATRIX COMPOSITE[J]. Acta Metallurgica Sinica, 1999, 35(2): 198-202 |
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| Authors: | ZHANG Xinping WEI Wei QUAN Gaofeng |
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| Abstract: | The present work has investigated the joining characteristics of SiCp reinforced aluminiummatrix composite(SiCp -reinforced AMC) by vacuum diffusion bonding process. The joining performancesof similar and dissimilar composites have been studied in detail, and the influence of the insert alloy layeron bonding quality and the property of the joints has also been estimated. The experimental resultsindicate that the strength of diffusion bonded joints decreases with increase SiCp volume percentage,and the vacuum diffusion bonding of dissimilar SiCp-reinforced AMC with satisfactory joining quality ismore difficult than that of similar composites. For the diffusion bonding of either similar or dissimilarSiCp-reinforced AMC, the suitable insert alloy layer can improve evidently the joining quality of joints,and the strength of diffusion bonded joints using the insert alloy layer is apparently higher than that of noinsert layer. |
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| Keywords: | SiCp-reinforced aluminium matrix composite vacuum diffusion bonding joining char-acteristics joint strength insert alloy layer |
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