| 激光重熔PBGA钎料球与Au/Ni/Cu焊盘的界面反应 |
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| 引用本文： | 田艳红,王春青.激光重熔PBGA钎料球与Au/Ni/Cu焊盘的界面反应[J].金属学报,2002,38(1):95-98. |
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| 作者姓名： | 田艳红 王春青 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨,150001 |
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| 摘 要： | 研究了塑料球栅阵列（PBGA）钎料球重熔过程中钎料与Au/Ni/Cu焊接之间的界面反应，结果表明：界面处金属间化合物的生成与激光输入量能密切相关，当激光输入能量较小时，焊盘上的Au没有完全溶解到钎料中，界面处存在一层连续的AuSn2和一些垂直或斜向生长到钎料中的针状AuSn4化合物，增大激光输入能量，Au完全溶解到钎料中，界而处连续的AuSn2化合物层全部转化为针状AuSn4相，有部分AuSn4针从界面处折断并落入钎料中，当激光功率为18W，激光加热时间为400ms时，AuSn4相在界面处消失，以细小颗粒弥散分布在钎料内部。
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| 关 键 词： | 塑料球栅阵列 钎料球 激光重熔 界面反应 |
| 文章编号： | 0412-1961(2002)01-0095-04 |
| 修稿时间： | 2001年6月11日 |
INTERFACIAL REACTION BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu PAD DURING LASER REFLOW |
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| TIAN Yanhong,WANG Chunqing.INTERFACIAL REACTION BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu PAD DURING LASER REFLOW[J].Acta Metallurgica Sinica,2002,38(1):95-98. |
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| Authors: | TIAN Yanhong WANG Chunqing |
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| Abstract: | Interfacial reaction between plastic ball grid array(PBGA) solder ball and Au/Ni/Cu pad during laser reflow soldering was studied. Results show that the morphology of intermetallic compounds at interface is strongly influenced by laser input energy. When laser input energy was small, a continuous AuSn2 layer and needle-like AuSn4 are found at the interface. With the increase of laser input energy, all the continuous AuSn2 layer converts into needle-like AuSn
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| Keywords: | plastic ball grid array(PBGA) solder ball laser reflow interfacial reaction |
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