Effect of Cd as a stabilizer in the electroless nickel plating system |
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Authors: | Zongyuan Xiao Wenjing Wang Liyi Ye Yong Sha Song Tu |
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Affiliation: | Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, Fujian 361005, PR China |
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Abstract: | Bath decomposition is a major problem in the electroless nickel (EN) plating system. Although the stabilization mechanism is far from being fully understood, bath stabilizers are normally added to extend the bath life in a viable EN plating solution. In this study, the effects of Cd2+ as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated. The deposited films were examined using a scanning electron microscope (SEM) equipped with energy dispersive X-ray (EDX) spectroscopy and the X-ray photo spectroscopy (XPS). The electronic tunneling mechanism was used to elucidate the effect of the Cd2+ stabilizer on the plating system theoretically. The results calculated from theoretical method agreed well with the experimental data. |
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Keywords: | Electroless nickel plating Stabilizer Plating rate Bath stability Corrosion resistance |
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