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| Bi-Sr-Ca-Cu-O高温超导材料的连接技术 | |
| 引用本文： | 邹贵生,吴爱萍,胡乃军,白海林,王延军,任家烈,宋秀华,易汉平,宗军,史锴.Bi-Sr-Ca-Cu-O高温超导材料的连接技术[J].金属热处理,2006,31(6):1-9. |
| 作者姓名： | 邹贵生 吴爱萍 胡乃军 白海林 王延军 任家烈 宋秀华 易汉平 宗军 史锴 |
| 作者单位： | 1. 清华大学,机械工程系和教育部先进成形制造重点实验室,北京,100084 2. 北京英纳超导技术有限公司,北京,100176 3. 北京英纳超导技术有限公司,北京,100176;清华大学,应用超导研究中心,北京,100084 4. 清华大学,应用超导研究中心,北京,100084 |
| 基金项目： | 国家自然科学基金;北京市自然科学基金;高比容电子铝箔的研究开发与应用项目 |
| 摘 要： | Bi-Sr-Ca-Cu-O（BSCCO）高温超导材料在电力工程中拥有广阔的应用前景。本文全面概述了国内外研究Bi系高温超导材料连接技术的现状和不足，重点介绍了BSCCO带材常规冷压成形后再高温反应退火的扩散焊连接技术，另外，阐述了近几年采用高温加压直接扩散连接的最新研究成果。 |
| 关 键 词： | Bi-Sr-Ca-Cu-O(BSCCO)高温超导材料 软钎焊 扩散连接 高温加压扩散连接 |
| 文章编号： | 0254-6051（2006）06-0001-09 |
| 收稿时间： | 2006-03-23 |
| 修稿时间： | 2006年3月23日 |
Bonding Technologies of BSCCO High Temperature Superconductor Materials |
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| ZOU Gui-sheng,WU Ai-ping,HU Nai-jun,BAI Hai-lin,WANG Yan-jun,REN Jia-lie,SONG Xiu-hua,YI Han-ping,ZONG Jun,SHI Kai.Bonding Technologies of BSCCO High Temperature Superconductor Materials[J].Heat Treatment of Metals,2006,31(6):1-9. | |
| Authors: | ZOU Gui-sheng WU Ai-ping HU Nai-jun BAI Hai-lin WANG Yan-jun REN Jia-lie SONG Xiu-hua YI Han-ping ZONG Jun SHI Kai |
| Affiliation: | 1. Department of Mechanical Engineering, Tsinghua University and Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education, Beijing 100084, China; 2. Innova Superconductor Technology Co. , Ltd, Beijing 100176, China; 3. Applied Superconductivity Research Center, Tsinghua University, Beijing 100084, China |
| Abstract: | Bi-Sr-Ca-Cu-O(BSCCO)high temperature superconductor materials will be extensively used for electrical engineering applications.In this paper,systematic summarizations were made on the bonding technology developments of BSCCO superconductor materials,with emphases on the conventional diffusion bonding of BSCCO tapes through first cold welding and then reaction annealing at high temperature.The disadvantages of the available bonding technologies were appointed out.In addition,the recent achievements with the new technology of direct pressuring diffusion bonding at high temperatuse were expounded. |
| Keywords: | BSCCO high temperature superconductor materials soldering diffusion bonding pressuring diffusion bonding at high temperature |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |