| 影响铜粉和镍粉界面过程的因素 |
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| 引用本文： | 宋玉强,李世春.影响铜粉和镍粉界面过程的因素[J].金属热处理,2003,28(4):17-21. |
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| 作者姓名： | 宋玉强 李世春 |
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| 作者单位： | 石油大学机,电学院材料系,山东,东营,257061 |
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| 基金项目： | 国家自然科学基金 (5 98710 31)——多层材料界面电子分布对材料性能的影响 |
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| 摘 要： | 研究了在铜粉和镍粉反应形成固溶体组织的过程中，影响铜粉和镍粉界面扩散和迁移的因素。结果表明，粉末颗粒均匀、1：1质量配比、采用机械混料、二次温压和快速加压、提高压制压力和烧结温度以及延长保温时间都可以促进反应过程中的界面扩散和迁移。
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| 关 键 词： | 铜粉 镍粉 界面 影响因素 |
| 文章编号： | 0254-6051(2003)04-0017-05 |
Affecting Factors on Interface-Forming Process of Cu Powder and Ni Powder |
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| SONG Yu qiang,LI Shi chun.Affecting Factors on Interface-Forming Process of Cu Powder and Ni Powder[J].Heat Treatment of Metals,2003,28(4):17-21. |
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| Authors: | SONG Yu qiang LI Shi chun |
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| Abstract: | The affecting factors on interface diffusion and migration of Cu and Ni powders have been investigated during the process of Cu Ni solid solution which be formed by reaction of Cu and Ni powders.The results showed that it could improve the interface diffusion and migration during the reaction that volume of powder granules might be similar,the 1 to 1 weight ratio of Cu and Ni,the powder of Cu and Ni was mechanically mixed and second warm compacted,the pressure loading rate was quick,the sintering temperature and compacting pressure were increased as well as the hold time was prolonged. |
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| Keywords: | Cu powder Ni powder interface affecting factors |
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