选区电化学沉积镍镀层的微观形貌及耐磨性

利用选区电化学沉积技术在45钢基体上沉积镍镀层,并对其进行形貌观察、能谱分析探寻选区电化学沉积镍镀层组织生长规律,并将镀层和基体耐磨性进行了试验对比。结果表明,选区电化学沉积生长过程为由小型颗粒逐步生长堆叠成为致密镀层;晶粒生长呈螺旋式上升堆叠形态,球状晶粒内部和表面存在微裂纹;晶粒间隙处存在氧元素,氧化反应对于小型晶粒之间的相互融合起抑制作用;选区电化学沉积镍镀层结构组织更加致密,镀层组织与基体组织间存在明显的分界线,镀层组织相较于基体材料耐磨性更好。

Micromorphology and wear resistance of selective electrochemically deposited nickel coating

Nickel coating was deposited on the 45 steel substrate by the selective electrochemical deposition technique, the growth law of the electrochemical deposited nickel coating in the selected area was explored by the morphology observation and energy spectrum analysis, and the wear resistance of the coating and the substrate was compared. The results show that the growth process selective electrochemical deposition is gradual by stacking of small particles into a dense coating; the growth of the grains is spirally stacked, with microcracks inside and on the surface of the spherical grains. Oxygen is present in the gaps between the grains, and oxidation reaction inhibits the mutual fusion of small crystal grains; the structure of electrochemically deposited nickel coatings in selected areas is denser, and there is a clear boundary between the coating structure and the matrix structure, and the coating structure has better wear resistance than the matrix material.