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Al/SiCp陶瓷基复合材料伪半固态触变成形
引用本文:罗守靖,程远胜,杜之明.Al/SiCp陶瓷基复合材料伪半固态触变成形[J].特种铸造及有色合金,2005,25(1):13-15.
作者姓名:罗守靖  程远胜  杜之明
作者单位:哈尔滨工业大学
基金项目:国家自然科学基金资助项目 (50 3750 35)
摘    要:在粉末冶金的基础上,结合半固态金属加工技术和陶瓷成形的发展,提出陶瓷基复合材料伪半固态触变成形工艺并且以SiCp为基体,Aσ(Al)=30%]为增塑相,通过该工艺成形卫星角框架制件。结果表明,该工艺成形的零件微观组织比较均匀,HV可达6.43Gpa,应变ε约为0.5%,抗拉强度约为300 MPa,为陶瓷复合材料以及高熔点材料在更多领域中的应用起到推进作用。

关 键 词:粉末冶金  伪半固态  触变成形  SiCp  复合材料
文章编号:1001-2249(2005)01-0013-03
修稿时间:2004年4月6日

Al/SiCp Ceramic Matrix Composites Thixoforming in Pseudosemi-solid State
Luo Shoujing,Chen Yuansheng,Du Zhiming.Al/SiCp Ceramic Matrix Composites Thixoforming in Pseudosemi-solid State[J].Special Casting & Nonferrous Alloys,2005,25(1):13-15.
Authors:Luo Shoujing  Chen Yuansheng  Du Zhiming
Abstract:A new forming method,the ceramic matrix composites thixoforming in pseudo-semi-solid state,was presented based on the powder metallurgy in combination with the semi-solid metal forming and the developing direction of the ceramic forming in the 21st century. The angle-frames were produced by the method with SiC p as the matrix materials and 30Al as the plasticization phase.The results show that the component' microstructure with 6.43 GPa Hv and about 0.5% strain stress as well as about 300 MPa tesile strength is homogeneously formed. It will play a very important role in promoting the application of the ceramic matrix composites and high melt point materials in more fields.
Keywords:Powder Metallurgy  Pseudo-semi-solid  Thixoforming  SiCp Composites
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