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溶胶-凝胶法应用于Cu粉抗氧化工艺研究
引用本文:闫军,崔海萍,杜仕国,刘献杰.溶胶-凝胶法应用于Cu粉抗氧化工艺研究[J].特种铸造及有色合金,2006,26(7):459-461.
作者姓名:闫军  崔海萍  杜仕国  刘献杰
作者单位:石家庄军械工程学院,石家庄050003
摘    要:应用钛酸丁酯水解形成二氧化钛溶胶对铜粉表面进行包覆处理,样品的耐腐蚀性通过在5%硫酸溶液中浸泡,然后测定溶液在760nm处的透光率来表征,据此研究了不同加水量、加酸量以及溶胶用量对包覆处理效果的影响。结果表明,钛酸丁酯与水的摩尔比为1:2,H^+浓度为0.32mol/L,溶胶用量在4%~6%范围内,包覆样品浸泡4h后溶液的透光率为80%以上,而原始样品为15%。应用SEM、EDS、XPS以及XRD对包覆样品进行表征。XPS结果表明,样品表面主要有C、Ti、Sn、O、Cu等元素,其中Ti、Sn元素分别为四价和二价。对空气中放置60天后的包覆样品以及原始粉体的X射线衍射(XRD)检测表明,原始粉体表面有Cu2O存在,而包覆处理Cu粉的图谱中仅出现Cu的特征峰。

关 键 词:溶胶-凝胶法  Cu粉  抗氧化
文章编号:1001-2249(2006)07-0459-03
收稿时间:2006-03-16
修稿时间:2006年3月16日

Sol-Gel Process for Improving the Oxidation-resistance of Copper Powder
Yan Jun,Cui Haiping,Du Shiguo,Liu Xianjie.Sol-Gel Process for Improving the Oxidation-resistance of Copper Powder[J].Special Casting & Nonferrous Alloys,2006,26(7):459-461.
Authors:Yan Jun  Cui Haiping  Du Shiguo  Liu Xianjie
Abstract:TiO_2 film is formed to clad the surface of the Cu powder by hydrolyzing sol-gel process for improving the oxidation resistance of copper powders. Effects of various water, acid and sol-gel quantity on cladding effects are investigated by measuring transmissivity rate away from 760 nm of the solution under the condition of eroding the samples in 5% H_2SO_4 solution for four hours. The results show that the transimissivity rate of the coat samples at 760 nm is more than 80% with 1 to 2 of Ti(OBu)_4 and H_2O, 0.32 mol/L of H~+ content and 4%~6% TiO_2 sol, while that of initial samples is 15%.SEM, EDS, XPS and XRD are employed to characterize the coated samples. XPS analysis shows that the main elements in the surface of the coated copper podwders are Ti, Sn, C, O and Cu, in which Ti and Sn are in the state of Ti~ +4 and Sn~ +2 , respectively. The XRD analysis for coated copper powder and initial samples after 60 day in air indicates that the advents of Cu_2O in surface of the initial samples are observed, while only Cu can be observed in the coated samples.
Keywords:TiO2
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