| 铜基合金的强化机理和研制现状 |
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| 引用本文： | 李本贵,于艳,曹志强,方园,李廷举.铜基合金的强化机理和研制现状[J].铸造,2005,54(10):948-952. |
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| 作者姓名： | 李本贵 于艳 曹志强 方园 李廷举 |
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| 作者单位： | 1. 大连理工大学铸造工程研究中心,辽宁,大连,116024
2. 宝钢技术中心,上海,201900 |
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| 摘 要： | 在综述了铜合金强化原理的基础上,介绍了该类合金强化的最新技术及研究现状,并对其性能进行了展望.
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| 关 键 词： | 高强度 高导电性 强化机理 铜合金 |
| 文章编号： | 1001-4977(2005)10-0948-05 |
| 收稿时间： | 2005-04-19 |
| 修稿时间： | 2005-08-03 |
Mechanism and Research Status of Strengthening Cu-based Alloys |
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| LI Ben-gui,YU Yan,CAO Zhi-qiang,FANG Yuan,LI Ting-ju.Mechanism and Research Status of Strengthening Cu-based Alloys[J].Foundry,2005,54(10):948-952. |
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| Authors: | LI Ben-gui YU Yan CAO Zhi-qiang FANG Yuan LI Ting-ju |
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| Affiliation: | 1. Research Center of Foundry Engineering, Dalian University of Technology, Dalian 116024, Liaoning, China; 2. Technology Center of Baosteel, Shanghai 201900, China |
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| Abstract: | In this article, strengthening mechanism of copper alloys is reviewed, recent technologies on strengthening are introduced, and performances to be reached are prospected. |
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| Keywords: | high strength high conductivity strengthening mechanism copper alloy |
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