电子封装用Cu/Mo/Cu复合材料的工艺研究

研究了浸涂助复剂（铝基合金）和室温轧制工艺对Cu／Mo／Cu复合界面结合强度的影响，简述了Cu／Mo／Cu复合板室温轧制成形工艺过程，详细分析了表面和界面清理、初道次轧制临界变形率及热处理工艺等因素对复合板结合强度的影响。实验结果得出，钼板浸涂Al—Mn—Zn—Sn合金助复剂后的热处理温度为800～850℃；初道次轧制变形率为45％最佳；复合轧制后合适的退火工艺为450℃，保温60min。

Study on the Process of Cu/Mo/Cu Composite for Electronic Packaging

The development of the electronic packaging materials with good electric and thermal conduction,and right strength and rigidity has become a popular research. This kind of material is mainly used for the grid connected framework of large-scale integrated circuits and thermal control electronic devices.Cu/Mo/Cu cladding sheets have the required properties. Investigation has been carried out on the interface bonding strength of Cu/Mo/Cu composite sheets produced by room temperature rolling with a reagent coat(Al base alloy). The development of technology of Cu/Mo/Cu laminated composite with room temperature rolling deformation was summarized in this paper. It also analyzed the influence of the parameter of the composite technology upon the bond strength of the cladding sheet, so that the optimum composite technology was found,as well as the bond mechanism was investigated.