| 不锈钢和Ti基体上Cu，Ag，Ni膜中的内应力研究 |
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| 引用本文： | 任凤章,郑茂盛,周根树,赵文轸,顾海澄.不锈钢和Ti基体上Cu，Ag，Ni膜中的内应力研究[J].稀有金属材料与工程,2004,33(7):706-709. |
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| 作者姓名： | 任凤章 郑茂盛 周根树 赵文轸 顾海澄 |
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| 作者单位： | 西安交通大学,陕西,西安,710049 |
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| 基金项目： | 国家自然科学基金资助项目(59831040)，国家博士学科点基金资助项目 |
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| 摘 要： | 用电镀工艺在不锈钢基体上镀制了Cu,Ag,Ni膜的Ti基体上制备了Ni膜，并用悬臂梁法和X射法测量了膜中的残余应力。并基于改进的TFD模型，对任意膜厚下由界面电子转移引起的膜内应力作了理论估算。结果表明，理论估算所给出的膜内应力与实验测量值具有可比性，这说明理论计算模型具有较高的准确性和膜内残余应力主要由界面电子转移引起。
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| 关 键 词： | 薄膜 内应力 悬臂梁法 电子密度 TFD模型 |
| 文章编号： | 1002-185X(2004)07-0706-04 |
| 修稿时间： | 2002年12月18 |
Internal Stress in Cu, Ag and Ni Films on Stainless Steel and Ti Substrates |
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| Ren Fengzhang,Zheng Maosheng,Zhou Genshu,Zhao Wenzhen,Gu Haicheng.Internal Stress in Cu, Ag and Ni Films on Stainless Steel and Ti Substrates[J].Rare Metal Materials and Engineering,2004,33(7):706-709. |
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| Authors: | Ren Fengzhang Zheng Maosheng Zhou Genshu Zhao Wenzhen Gu Haicheng |
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| Abstract: | Cu, Ag and the Ni films on stainless steel bases and Ni film on Ti substrates are prepared by using electroplating. The cantilever beam method and X ray diffraction are used to measure the internal stresses in the films. Internal stresses caused by interfacial electron transfer are also calculated using the modified TFD model. It is shown that the calculated results are comparable with those of the experiments, indicating that the main source of the internal stress in the films is the interfacial electron transfer. |
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| Keywords: | film internal stress cantilever beam method electron density TFD model |
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