| 悬臂梁法测量不锈钢基体上铜膜和银膜残余应力 |
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| 引用本文： | 任凤章,周根树,赵文轸,胡志忠,郑茂盛.悬臂梁法测量不锈钢基体上铜膜和银膜残余应力[J].稀有金属材料与工程,2003,32(6):478-480. |
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| 作者姓名： | 任凤章 周根树 赵文轸 胡志忠 郑茂盛 |
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| 作者单位： | 1. 西安交通大学金属材料强度国家重点实验室,陕西,西安,710049;河南科技大学,河南,洛阳,471003
2. 西安交通大学金属材料强度国家重点实验室,陕西,西安,710049 |
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| 基金项目： | 国家自然科学基金资助项目(59831040)，国家博士学科点基金资助项目 |
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| 摘 要： | 用悬臂梁法研究了不锈钢4Cr13基体上的Cu膜和Ag膜的平均残余应力和残余应力分布。结果表明，Cu膜和Ag膜的平均残余应力和分布残余应力随膜厚的增加而急剧减小。2种膜生长过程中界面应力很大，而生长应力很小。Cu膜在厚度较小时，残余应力值很大，超过了铜块材的断裂强度。
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| 关 键 词： | 悬臂梁法 薄膜 残余应力 界面应力 生长应力 |
| 文章编号： | 1002-185X(2003)06-0478-03 |
| 修稿时间： | 2001年9月10日 |
Determination of Residual Stresses in Cu and Ag Films on Stainless Steel Substrates by Cantilever Beam Method |
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| Ren Fengzhang,Zhou Genshu,Zhao Wenzhen,Hu Zhizhong,Zheng Maosheng.Determination of Residual Stresses in Cu and Ag Films on Stainless Steel Substrates by Cantilever Beam Method[J].Rare Metal Materials and Engineering,2003,32(6):478-480. |
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| Authors: | Ren Fengzhang Zhou Genshu Zhao Wenzhen Hu Zhizhong Zheng Maosheng |
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| Abstract: | Mean and local residual stresses in Cu films and Ag films on 4Cr13 substrates are evaluated by cantilever beam method. The results show that the mean and local residual stresses in Cu films and Ag films decrease abruptly with the film thickness, then tend to be stable. The residual stress in the two kinds of films mainly originates from the interfacial misfit strain. Their interfacial stress is very large and the growing stress is small. The mean value of residual stress in thin Cu films is very large, even beyond the fracture strength of the bulk Cu material. |
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| Keywords: | cantilever beam method film residual stress interfacial stress growing stress |
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