脉冲电压幅值与电解液流动状态对无掩模定域性电沉积微镍柱的影响

为探究脉冲电压幅值与电解液流动状态对无掩模定域性电沉积微镍柱的影响,采用体视显微镜和扫描电子显微镜SEM对电沉积的微镍柱进行观察、检测,并计算了平均沉积直径和速率。在实验的基础上通过控制变量法研究了脉冲电压幅值与电解液流动状态对沉积微镍柱平均直径、平均沉积速率和表面形貌的影响。研究表明,当脉冲电压幅值在3.8~4.4 V时,电压幅值越大,微镍柱沉积速率越大,表面形貌越粗糙;平均沉积直径和速率会随电解液流动状态变化而发生改变,当流量在0.025~0.25 mm³/s时,沉积速率随电解液流量的增加而加快;电压由3.8 V增至4.4 V时,液滴、微液滴和微射流状态下微镍柱沉积直径增大,冲击射流状态下微镍柱直径则先增大后减小且微镍柱顶部呈明显的尖锥状并在镍柱周边存在"毛刺";微镍柱的表面形貌随电解液流动状态的不同而不同,大流量喷射(0.25 mm³/s)条件下,微镍柱表面更平整、致密。

The Effect of Pulse Voltage Amplitude and Electrolyte Flow States on Manufacture of Micro Nickel Column by Mask-less Localized Electrochemical Deposition

In order to explore the influence of different electrolyte flow states on mask-less localized electrodeposition, the nickel column was detected by stereoscopic microscopy and scanning electron microscopy, and the average deposition diameter and rate were calculated. On the basis of experiments, the effects of pulse voltage amplitude and electrolyte flow states on average deposition diameter, average deposition rate and surface morphology of micro nickel column were studied by means of control variable method. The research shows that the higher pulse voltage amplitude leads to the greater deposition rate and rougher surface of the micro-nickel column. the average deposition diameter and rate will change with the change of electrolyte flow states, and the deposition rate will increase with the increase of the flow rate of the electrolyte. The increase of the voltage in droplet, droplet and micro-jet will lead to the increase of the deposition diameter of the micro-nickel column. In the impinging jet state, the diameter of the micro-nickel column will first increase and then decrease with the increase of the voltage. At the same time, the tip of the nickel column is obviously tapered and there are "burrs" around the nickel column. The surface of nickel column varies with the velocity of each injection mode. The surface of nickel column is denser under the condition of high velocity injection.