高温、短时Pd/Ti之间相互扩散行为的研究

为了研究高温下短时间Pd/Ti间的互扩散行为,在Ti表面利用磁控溅射技术沉积了Pd膜层,然后分别对Pd/Ti试样进行500℃/5 h,550℃/5 h,600℃/5 h和700℃/5 h高温处理,用XRD、SEM和EDS研究合金层的相组成、微观组织和元素分布。研究发现:当Pd/Ti试样经500℃/5 h处理后,Pd/Ti之间有极轻微的互扩散发生。当温度升高到550℃时,Pd/Ti间产生了连续的扩散层,随着温度升高,膜层之间的互扩散加剧。并且,当温度升高到700℃时,Pd/Ti之间形成了相图中除Ti3Pd5相和Ti3Pd相以外的其余各化合物相。还分析了Pd/Ti界面扩散反应动力学。结果表明,扩散层厚度的增加经历了一个由界面反应动力学控制到扩散控制的过渡。

Interdiffusion between Palladium and Titanium at High Temperatures in a Short Time

In order to study the interdiffusion between Pd and Ti at high temperatures in a short time, the Pd coating was prepared on the surface of C.P.Ti by the magnetron sputtering technique. The Pd/Ti samples were heat-treated at 500, 550, 600 and 700 °C for 5 h. The phase composition, microstructure and element distribution of alloy layers were studied by XRD, SEM and EDS. The result shows that after the Pd/Ti sample is heat-treated at 500 °C for 5 h, a very slight interdiffusion occurs between Pd and Ti. When the temperature rises to 550 °C, a continuous diffusion layer appears between Pd coating and the substrate. As the temperature increases further, the interdiffusion becomes more and more obvious. When the temperature rises to 700 °C, TiPd3, TiPd2, Ti2Pd3, TiPd and Ti2Pd compound phases are observed on the alloyed surface layer. This paper also analyzed the Pd/Ti interface diffusion and reaction kinetics. The results indicate that increase of diffusion layer thickness experiences a process from interface reaction control to diffusion control.