AuSn钎料及镀层界面金属间化合物的演变

对激光软钎焊下AuSn钎料与Au和Au/Ni金属化镀层界面形成的金属间化合物进行SEM及EDX分析,并讨论激光输入能量对界面金属间化合物演变规律的影响.研究结果表明：在激光加热及快速冷却条件下,Au迅速溶解到界面附近的钎料中,使得成分偏离共晶点,界面处生成稳定的Au5Sn;随着激光功率及加热时间的增加,未完全溶解的Au层变薄,Au5Sn向钎料内部长大.

Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

This paper investigates the intermetallic compound on the interface between AuSn solder and Au or Au/Ni metallization layer after laser soldering by SEM and EDX analysis. The effects of laser power and heating time on the evolution of intermetallic compounds on the interface are discussed. The results show that the components of Jntermetallic compound depart from the eutectic arrest due to Au dissolving quickly into the solder near the interface and forming a stable AusSn at the interface on the condition of laser heating and cooling quickly. With the increase of laser power and heating time, the undissolved Au layer becomes thinner and the AusSn grows into the solder.