锡-银系无铅焊料动态强度研究

利用分离式霍普金森压杆试验技术,在室温下研究了锡-银系无铅焊料在高应变率条件下的动态压缩力学性能。结果表明,锡-银系无铅焊料有显著的应变率效应:随着应变率的增加,材料的屈服强度和流动应力有显著的提高;在对数坐标系下其动态屈服强度随应变率呈线性变化,证明锡-银系焊料是一种很有希望替代锡铅焊料的无铅焊料。最后根据Malvern过应力理论建立了锡-银系无铅焊料的动态本构关系。

Dynamic Strength of Pb-free Sn-Ag Based Solders

The dynamic compressive properties of Sn-Ag Pb-free solders have been studied by means of a split Hopkinson pressure bar at high strain rates. Tests were conducted at room temperature and under uniaxial compressive conditions. The dynamic mechanical properties and the effect of strain-rate on lead-free solder are discussed. And it is found that the dynamic yield stress of the solders largely falls into a linear relation to the strain rate in logarithm scales. Phenomenological constitutive relations were then established following Malvern theory.