金属基电子封装材料进展

对照几种传统的金属基电子封装材料 ,较详细地阐述了 W Cu、Mo Cu、Si C/ Al等新型封装材料的性能特点、制造方法、应用背景以及存在的问题。介绍了金属基电子封装材料的最新发展动态 ,指出国际上近年来的研究与开发主要集中在净成型技术、新材料体系探索以及材料的集成化应用等方面。最后 ,文章对金属基电子封装材料的发展趋势进行了展望 ,作者认为 ,未来的金属基电子封装材料将朝着高性能、低成本、轻量化和集成化的方向发展

ADVANCES IN METAL－MATRIX MATERIAL FOR ELECTRONIC PACKAGING

Compared with several traditional metal-matrix electronic packaging materials, the characteristics,fabricating technology,application prospect and existing problems of the new packaging materials such as WCu,MoCu and SiC/Al ect are elaborated in detail.The recent developments of the metal-matrix electronic packaging material are presented.It is pointed out that the recent R & D abroad of the electronic packaging material are focused on netshaping technology,new composite system exploring and integrating application of material etc.At last,the developing tendency of the metalmatrix electronic packaging material was forecasted in this paper.The author believes that high performance,low cost,light weight and integration will be the future characteristics of the metalmatrix electronic packaging material.