化学镀Ni－Cu－P合金的工艺及镀层性能研究

探讨了化学镀Ｎｉ－Ｃｕ一Ｐ合金的镀液组成及工艺条件，并采用Ｘ射线衍射和弯曲法，研究了Ｎｉ－Ｃｕ－Ｐ镀层的组织结构和镀层结合力，结果表明，所研究的镀液组成，在适当工艺条件下，能够实现Ｎｉ、Ｃｕ离子的共沉积，并得到良好质量的合金镀层。经４００℃热处理，镀层中有和相析出，同时硬度达到最大值。镀态下，该镀层具有良好的结合力，且随镀层中铜含量的增加和热处理温度的提高，镀层结合力能得到进一步改善。

TECHNOLOGY AND COATING PROPERTIES OF ELECTROLESS Ni-Cu-P PLATING

In this paper the bath composition and technical condition of clectroless Ni-Cu-P plating have been discussed,the structure and the adhesion of Ni-Cu-P coatings have been studied also by means of X-ray diffraction and bending method.The results show that the nickel and copper ions ean be codeposited in the bath composition studied and good coating can be obtained under proper technical conditions.The Ni_3P and Cu_3P phases are precipitated from the coating and the greatest hardness value is aehieved by heat treatment at 400℃,The coating has good adhesion under the as-deposited,the adhesion of the coating can be improved further when the copper content of the coating and heat treatment temperature are increased.