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高体积分数SiC_p/Al复合材料的热物理性能
引用本文:张建云,王磊,周贤良,华小珍.高体积分数SiC_p/Al复合材料的热物理性能[J].兵器材料科学与工程,2006,29(3):10-13.
作者姓名:张建云  王磊  周贤良  华小珍
作者单位:南昌航空工业学院,材料工程系,江西,南昌,330034
摘    要:采用无压渗透法制备了高体积分数SiCp/Al复合材料,用XRD对复合材料的物相进行了分析,测定了SiCp/Al复合材料在25~200℃温度区间的热膨胀系数及热导率,运用理论模型对复合材料的热膨胀系数以及热导率进行了计算,并探讨了热物理性能与温度之间的关系。结果表明,高体积分数SiCp/Al复合材料具有较低的热膨胀系数、高的热导率,综合热物理性能优良。

关 键 词:电子封装  SiCp/Al复合材料  热膨胀系数  热导率  热膨胀模型  热导率模型
文章编号:1004-244X(2006)03-0010-04
收稿时间:2005-08-22
修稿时间:2005-12-16

Thermophysical properties of high volume fraction SiCp/Al composite
ZHANG Jian-yun,WANG Lei,ZHOU Xian-liang,HUA Xiao-zhen.Thermophysical properties of high volume fraction SiCp/Al composite[J].Ordnance Material Science and Engineering,2006,29(3):10-13.
Authors:ZHANG Jian-yun  WANG Lei  ZHOU Xian-liang  HUA Xiao-zhen
Affiliation:Department of Material Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330034, China
Abstract:The high volume fraction SiCp/Al composite was fabricated by pressureless infiltration. The phases of SiCp/Al composite were investigated by X-ray diffraction(XRD). The coefficient of thermal expansion(CTE) and the thermal conductivity of SiCp/Al composite were measured in the temperature range of 25~200 ℃. Theoretical models were employed to calculate the CTE and thermal conductivity of the composite, and the relationship between the thermophysical properties and temperature was analyzed. The result shows that the high volume fraction SiCp/Al composite has low coefficient of thermal expansion and high thermal conductivity, the combined thermophysical properties are excellent.
Keywords:electronic packaging  SiCp/Al composite  coefficient of thermal expansion  thermal conductivity  model of CTE  model of thermal conductivity
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