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对用XPS技术评价塑料粘结炸药造型粉包覆度的几点看法
引用本文:宋华杰,董海山,郝莹.对用XPS技术评价塑料粘结炸药造型粉包覆度的几点看法[J].兵工学报,2002,23(1):132-135.
作者姓名:宋华杰  董海山  郝莹
作者单位:南京理工大学化工学院,江苏南京,210094,中国工程物理研究院化工材料研究所
基金项目:中国工程物理研究院科技基金;990564;
摘    要:目前有些文献常采用通过PBX造型粉有关元素的XPS峰强度(或峰面积)数据来评估PBX造型粉的包覆度.本文通过对该评估方法的理论简析及用于评估TATB/氟聚物造型粉包覆度的XPS实验数据分析后,发现用该法评估PBX造型粉包覆度在理论上存在局限性;用此方法得到的TATB/氟聚物造型粉包覆度无法令人信服.

关 键 词:光电子能谱  1  3  5-三氨基-2  4  6-三硝基苯  塑料粘结炸药  造型粉  包覆
修稿时间:2001年1月1日

SOME VIEWS ON THE EVALUATION OF DEGREES OF COVERAGE OF PLASTICS-BONDED EXPLOSIVE'S MOLDING POWDER USING X-RAY PHOTOELECTRON SPECTROSCOPY
Abstract:In some present literatures the method frequently given to evaluate the degree of coverage of molding powder for plastic bonded explosives(PBXs) is through the X ray photoelectronic spectroscopic intensities of the PBX samples. A simple theoretical analysis of the method and analyses of the experimental data on XPS for estimating the degrees of coverage of molding powders composed of TATB and different fluoropolymers were given in this paper. It has been discovered that there exist much theoretical limitations in the method, and that the degrees of coverage of the TATB / fluoropolymers molding powders obtained according to this method is often dubious.
Keywords:X  ray photoelectron spectroscopy  1  3  5  triamino  2  4  6  trinitrobenzene  plastic bonded explasive  molding powder  coverage
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