TATB基PBX界面热阻研究及导热系数预测

为研究TATB基高聚物粘接炸药(PBX)中炸药晶体与粘结剂之间的界面热阻,采用在TATB单质药片上涂覆氟橡胶层的方法,制备了TATB基PBX单层界面样品,并通过纳米压痕法获得了界面样品氟橡胶层及界面层厚度,利用激光热导仪测得TATB/氟橡胶界面层在293,303,313,323,333 K下的导热系数分别为6.18×10~(-3),6.53×10~(-3),9.87×10~(-3),2.16×10~(-2),7.72×10~(-3)W·m~(-1)·K~(-1)。基于界面导热系数与热阻的关系,建立含界面热阻的PBX导热系数预测模型,获得了某型PBX导热系数理论值,理论计算结果与实测值吻合性较好。

The Simulation of Thermal Conductivity Coefficien of TATB-based PBX Using the Interface Thermal Resistance Model

Based on the relation of thermal conductivity and thermal resistance, the interface-resistance- baseed thermal conductivity model was established to predicet the PBX thermal conductivity. The interface-contained samples were prepared by coating fluorine rubber on the surface of TATB pill. The conductivitys of as-repared samples and TATB pills and fluorine rubbers pills were measured by using the flash diffusivity method. The coefficient of thermal conductivity of TATB/fluorine rubber layer are 6.18×10^-3, 6.53×10^-3, 9.87×10^-3, 2.16×10^-2, 7.72×10 -3 W·m^-1·K^-1, respectively at 293-333 K. The thermal conductivity of the TATB-based PBX was obtained by using the thermal condctivity model. The results of caculation were well agreed with the test value.