| Study on Integrated Thermal Cycle and Vibration Profile for HALT |
| |
| 作者姓名： | 陶俊勇 褚卫华 陈循 |
| |
| 作者单位： | TAO Jun-yong(College of Electromechanical Engineering and Automation,National University of Defense Technology,Changsha 410073 Hunan,China;Reliability and Risk Research Centre,Maryland University,Maryland 20742 United States of America);CHU Wei-hua(China Research and Development Centre of Aerodynamics,Mianyang 621000 Sichuan,China);CHEN Xun(College of Electromechanical Engineering and Automation,National University of Defense Technology,Changsha 410073 Hunan,China)
|
| |
| 基金项目： | Sponsored by the National Advanced Research Project of China(41319030101) |
| |
| 摘 要： | Focusing on electronic products, this paper establishes a finite element model for printed circuit board （PCB） assembling with enhanced ball grid array（EBGA）component under vibration environment. Based on this model, it studies relations between fatigue rate of solder joint and temperature, vibration frequency. Moreover, it analyzes propagation of micro-crack produced by thermal cycle under vibration stress. The results offer a method to optimize the thermal cycle and vibration integrated profile and to combine vibration test and thermal cycling for highly accelerated life test （HALT）.
|
| 关 键 词： | 振动环境 环和 高加速寿命试验 有限元模型 印刷电路板 电子产品 球栅阵列 振动频率 |
Study on Integrated Thermal Cycle and Vibration Profile for HALT |
| |
| TAO Jun-yong,CHU Wei-hua,CHEN Xun.Study on Integrated Thermal Cycle and Vibration Profile for HALT[J].Journal of China Ordnance,2009,5(2):81-87. |
| |
| Authors: | TAO Jun-yong CHU Wei-hua CHEN Xun |
| |
| Affiliation: | 1.College of Electromechanical Engineering and Automation;National University of Defense Technology;Changsha 410073 Hunan;China;2.Reliability and Risk Research Centre;Maryland University;Maryland 20742 United States of America;3.China Research and Development Centre of Aerodynamics;Mianyang 621000 Sichuan;China |
| |
| Abstract: | Focusing on electronic products, this paper establishes a finite element model for printed circuit board (PCB) assembling with enhanced ball grid array(EBGA)component under vibration environment. Based on this model, it studies relations between fatigue rate of solder joint and temperature, vibration frequency. Moreover, it analyzes propagation of micro-crack produced by thermal cycle under vibration stress. The results offer a method to optimize the thermal cycle and vibration integrated profile and to combine vibration test and thermal cycling for highly accelerated life test (HALT). |
| |
| Keywords: | mechanics viscoplasticity HALT nonlinear finite element analysis fatigue life solder joint J-integral |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
