Numerical investigation on the electronic components' cooling for different coolants by finite element method

In this study, we conducted a numerical simulation to examine the cooling performance of an aluminum finned heat sink attached to a silicon chip, placed in a chamber of a rectangular cross-section. The heat sink is cooled by convective heat transfer utilizing nine commercially available gaseous coolants, namely air, hydrogen, helium, nitrogen, oxygen, carbon dioxide, freon12 vapor, propane, and ammonia. To select an appropriate coolant for electronic devices in terms of thermal–hydraulic performance, the maximum temperature on the chip domain and the associated pressure drop in the cooling channel as a function of coolant velocity are analyzed for the aforementioned fluids. It has been found that the minimum temperature is recorded for propane and freon12 vapor, which is approximately 31.1°C, for a coolant velocity of 0.5 m/s, but freon12 vapor shows the highest pressure drop, approximately 900 mPa, among all coolants. In the overall velocity regime, hydrogen shows the best cooling performance in terms of both cooling capacity and hydrodynamic characteristics. But considering safety issues, helium can be a better alternative. This comprehensive study provides a better understanding of different coolant performances, which will aid engineers to develop an effective cooling technique to accommodate the inexorably rising power demand.