On the junction temperature of the QFN64 electronic package subjected to free convection: Effects of the encapsulating molding compound

ABSTRACT

The thermal conductivity of the molding compound (resin) used to encapsulate the QFN64 package significantly affects the thermal behavior of this electronic package during operation when it is subjected to natural convection. These effects are quantified in this work by varying the conductivity between ?80% and +100% of its average value. The 3D numerical solution carried out by means of the control volume method clearly shows that the maximal temperature reached in the junction of the device is affected by this parameter for a wide range of the generated power and various inclinations relative to the horizontal plane. The correlation proposed in this work allows optimizing the thermal design and increases the reliability, durability, performance, and correct operating of this electronic device widely used in various engineering fields.