| 封装设备加热单元的高精度温度控制 |
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| 引用本文： | 王正家,尹周平,熊有伦.封装设备加热单元的高精度温度控制[J].工业加热,2010,39(2):20-23. |
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| 作者姓名： | 王正家 尹周平 熊有伦 |
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| 作者单位： | 华中科技大学,数字制造装备与技术国家重点实验室,湖北武汉,430074 |
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| 基金项目： | 国家自然科学基金，国家高技术研究发展计划(863计划)重大课题 |
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| 摘 要： | 提出了一种通过使用有限元模型实现高精度温度控制的方法。在封装设备加热单元的高精度温度控制中,建立了热压头的参数化有限元模型,结合有限元模型以及设定的系统性能指标,对控制参数PID进行了优化。优化后提高了系统的响应速度及控制精度,并在封装设备的应用中取得了良好的效果。
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| 关 键 词： | 有限元 温度控制 最优化 |
High Accuracy Temperature Control of Beater Used in Electronic Packaging Equipments |
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| WANG Zheng-jia,YIN Zhou-ping,XIONG You-lun.High Accuracy Temperature Control of Beater Used in Electronic Packaging Equipments[J].Industrial Heating,2010,39(2):20-23. |
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| Authors: | WANG Zheng-jia YIN Zhou-ping XIONG You-lun |
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| Affiliation: | (State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China) |
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| Abstract: | An approach using finite element model to depict the heater unit is proposed in this paper. The finite element model is embedded in the simulation model of the thermal system in electronic packaging equipment. An optimal set of PID parameters is obtained based on the simulation model and given performance index. The results show that the proposed method supplies better performance and high accuracy and performs well in electronic packaging equipment. |
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| Keywords: | finite element model temperature control optimization |
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