基于高通量测序技术分析预包装豆干生产过程中的真菌污染风险

本文以豆干生产流程为采样顺序，结合二代高通量测序技术和传统微生物学方法，研究了食品接触表面、半成品和成品真菌污染情况。食品接触面和半成品存在明显的真菌污染，柯达酵母属（Kodamaea）、念珠菌属（Candida）、毛孢子菌属（Trichosporon）、链格孢属（Alternaria）和曲霉属（Aspergillus）为主要污染真菌。煮浆和终端高压杀菌工艺能有效减少豆浆及包装后产品的真菌菌落总数。食品接触表面比半成品显示更高的群落多样性和丰度，高风险接触表面包括:豆浆桶内壁、包布、碱处理缸壁、烘烤内壁和预包装内壁。破坏性实验结果显示真菌不是导致豆干货架期腐败的主要原因，真菌毒素残留风险待进一步研究。

Analysis of Fungal Contamination Risk in Pre-packaged DriedSoybean Curd Processing Line Based on High-throughputSequencing Technology

In this study,the fungal contamination in pre-packaged dried soybean curd processing line were analyzed by high-throughput sequencing technology,in combination with culture methods.The contact surface and semi-finished products of food had obvious fungal contamination,Kodamaea,Candida,Trichosporon,Alternaria and Aspergillus were detected to be the predominant contaminating fungal.Boiling and terminal sterilization process efficiently reduce the viable microbial count in soybean curd product.Food contact surfaces showed higher community diversity and abundance than semi-finished products.Conveying tanks,the tofu-covering cloth,the alkaline denaturation tank inner wall,baking inner wall and packaging hopper inner wall were high-risk contact surfaces.Fungi were not the main cause of shelf life spoilage but might induce mycotoxin residues risk.