磨料有序排布电镀砂轮的制备及其把持力研究

为解决电镀砂轮磨削加工中容屑空间不足的问题，采用点胶微粘接的方法制备了磨料有序排布的电镀砂轮，分析了磨料粘接效果和镀层力学性能。通过SEM分析了磨料/镀层/导电胶的结合界面，并进行了干磨削试验。研究结果表明，直径约为磨料粒径40%的胶点可粘接住磨料，单个胶点上粘接多颗磨料的占比小于6%；双脉冲电镀工艺制备的镀层显微硬度大于500HV，表层残余应力小于100MPa，磨料/镀层/导电胶之间的界面贴合紧密，无明显缺陷；砂轮在磨削时没有出现磨料脱落现象。

Preparation of Electroplated Grinding Wheels with Abrasive Ordering Configuration and Study on Pullout Strength

To solve the problems of insufficient storage chip spaces in grinding processes for electroplated grinding wheels, a new electroplated grinding wheel with abrasives ordering configuration was developed by the method of dispensing and adhesion for abrasives. Effectiveness of adhesive for abrasives and mechanics properties for coating were analyzed. Bonding interface characteristics among abrasives, coating, and conductive glue were described by SEM. Dry grinding experiments were carried out. Research results show that glue spots whose diameter accounts for about 40% of abrasive diameter may effectively bond abrasives, and keep abrasive overlap rate of single glue spot less than 6%. Micro hardness of the coating prepared by double pulse electroplating processes is higher than 500HV, and residual stress of surface layer is lower than 100MPa, while the bonding interfaces among the abrasives, the coating, and the conductive glue may integrate close with no obvious defects. There is no fall off of abrasives in dry grinding experiments.