细粒度金刚石砂轮超精密磨削硅片的表面质量

为实现硅片高质量表面的超精密磨削，研究了5000目、8000目和30 000目金刚石砂轮磨削硅片的表面质量。利用数学模型预测了硅片磨削表面的粗糙度Ra并对预测结果进行了试验验证，分析了硅片磨削表面的形貌特征；通过磨床主轴电机的电流变化对比分析了5000目、8000目和30 000目砂轮磨削过程中的磨削力变化趋势。研究结果表明：8000目砂轮磨削后的单晶硅表面粗糙度Ra小于10 nm,亚表面损伤深度小于150 nm,磨削过程中的磨削力稳定，磨削质量优于5000目砂轮，磨削过程的稳定性优于30 000目砂轮。

Surface Quality of Ultra-precision Grinding of Silicon with Fine Diamond Grinding Wheels

 In order to achieve high quality surfaces of silicon by ultra-precision grinding， the silicon surface quality ground by mesh number of 5000， 8000， and  30 000 fine grain diamond grinding wheels was studied. The silicon surface roughness Ra was calculated by mathematical model， and verified by experiments. The characteristics of the silicon surface morphology were analyzed. The force trend in grinding processes of mesh number of 5000， 8000， and 30 000 wheels was analyzed by changes of spindle current of grinding machine. The results show that the silicon surface roughness Ra after grinding with mesh number of 8000 grinding wheel is less than 10 nm， and the subsurface damage depth is less than 150 nm. The grinding force of 8000 grinding wheel is steady during the grinding processes， the grinding quality is better than that of mesh number of 5000 grinding wheels， and the grinding stability is better than that of mesh number of 30 000 grinding wheels.